Fraunhofer IZM

Area

Research Center for Microperipheric Technologies
Contact person: Dr.-Ing. Sibylle Dieckerhoff

Activities

Created models and performed thermal simulation with the software Flomerics Flotherm to characterize new packaging technologies for power semiconductor modules

Literature and market research about Smart Power modules in power electronics

Evaluated and presented the results using MS Office

Examples

CPES Embedded Power Modul mit Drahtbond
CPES Embedded Power Module Module with a wire bond
CPES Embedded Power Modul mit Drahtbond
CPES Embedded Power Module - Heat distribution Module with a wire bond - Heat distribution
CPES Embedded Power Leistungshalbbrücke mit 2 DCBs
CPES Embedded Power Module - Lateral cut Power bridge circuit with two DCB's - Lateral cut
Leistungshalbbrücke Leistungshalbbrücke mit Flex
Power bridge circuit Power bridge circuit with Flex
Leistungshalbbrücke MPIPPS
Power bridge circuit - Heat distribution Metal Posts Interconnected Parallel Plate Structure - Lateral cut